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Semiconductor parts processing

What are the precautions for materials in semiconductor parts processing

Semiconductor parts processing is not suitable for precision machining of all materials. Some materials are too hard to exceed the hardness of the processed machine parts, which may cause the machine parts to break. Therefore, these materials are not suitable for precision mechanical processing, except for machine parts made of special materials or laser cutting.

Materials for precision mechanical parts processing are divided into two major categories: metallic materials and non-metallic materials.

Among metallic materials, stainless steel has the greatest hardness, followed by cast iron, then copper, and finally aluminum.

The processing of ceramics, plastics, etc. belongs to the processing of non-metallic materials.

Firstly, there is the requirement for material hardness. In some cases, the higher the hardness of the material, the better. However, due to the hardness requirements of the processed machine parts, the processed material cannot be too hard. If it is harder than the machine parts, it cannot be processed.

Secondly, the material should be neither too hard nor too soft, at least one level lower than the hardness of the machine parts. At the same time, the purpose of the processed device should also be considered, and the materials for the machine parts should be selected reasonably.

In conclusion, there are still certain requirements for materials in precision mechanical processing. Not all materials are suitable for processing. For instance, materials that are too soft or too hard, the former is not necessary for processing, while the latter is impossible to process.